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MC14518B Dual Up Counters
The MC14518B dual BCD counter and the MC14520B dual binary counter are constructed with MOS P-channel and N-channel enhancement mode devices in a single monolithic structure. Each consists of two identical, independent, internally synchronous 4-stage counters. The counter stages are type D flip-flops, with interchangeable Clock and Enable lines for incrementing on either the positive-going or negative-going transition as required when cascading multiple stages. Each counter can be cleared by applying a high level on the Reset line. In addition, the MC14518B will count out of all undefined states within two clock periods. These complementary MOS up counters find primary use in multi-stage synchronous or ripple counting applications requiring low power dissipation and/or high noise immunity.
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16 PDIP-16 P SUFFIX CASE 648 MC14518BCP AWLYYWW 1 16 SOIC-16 DW SUFFIX CASE 751G 1 16 SOEIAJ-16 F SUFFIX CASE 966 Unit V V mA mW C C C 1 A = Assembly Location WL or L = Wafer Lot YY or Y = Year WW or W = Work Week MC14518B AWLYWW 14518B
* * * * *
Diode Protection on All Inputs Supply Voltage Range = 3.0 Vdc to 18 Vdc Internally Synchronous for High Internal and External Speeds Logic Edge-Clocked Design -- Incremented on Positive Transition of Clock or Negative Transition on Enable Capable of Driving Two Low-power TTL Loads or One Low-power Schottky TTL Load Over the Rated Temperature Range
AWLYYWW
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.)
Symbol VDD Vin, Vout Iin, Iout PD TA Tstg TL Parameter DC Supply Voltage Range Input or Output Voltage Range (DC or Transient) Input or Output Current (DC or Transient) per Pin Power Dissipation, per Package (Note 3.) Operating Temperature Range Storage Temperature Range Lead Temperature (8-Second Soldering) Value - 0.5 to +18.0 - 0.5 to VDD + 0.5 10 500 - 55 to +125 - 65 to +150 260
ORDERING INFORMATION
Device MC14518BCP MC14518BDW MC14518BDWR2 Package PDIP-16 SOIC-16 SOIC-16 SOEIAJ-16 SOEIAJ-16 Shipping 2000/Box 47/Rail 1000/Tape & Reel See Note 1. See Note 1.
2. Maximum Ratings are those values beyond which damage to the device may occur. 3. Temperature Derating: Plastic "P and D/DW" Packages: - 7.0 mW/_C From 65_C To 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS (Vin or Vout) VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
MC14518BF MC14518BFEL
1. For ordering information on the EIAJ version of the SOIC packages, please contact your local ON Semiconductor representative.
v
v
(c) Semiconductor Components Industries, LLC, 2000
1
March, 2000 - Rev. 3
Publication Order Number: MC14518B/D
MC14518B
PIN ASSIGNMENT
CA EA Q0A Q1A Q2A Q3A RA VSS 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VDD RB Q3B Q2B Q1B Q0B EB CB
BLOCK DIAGRAM
CLOCK 1 2 ENABLE 7 CLOCK 9 10 ENABLE 15 VDD = PIN 16 VSS = PIN 8 C R Q0 Q1 Q2 Q3 11 12 13 14 C R Q0 Q1 Q2 Q3 3 4 5 6
TRUTH TABLE
Clock Enable 1 0 X X 0 1 X X Reset 0 0 0 0 0 0 1 Action Increment Counter Increment Counter No Change No Change No Change No Change Q0 thru Q3 = 0
X = Don't Care
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MC14518B
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic Symbol VOL VDD Vdc 5.0 10 15 5.0 10 15 5.0 10 15 VIH 5.0 10 15 IOH Source 5.0 5.0 10 15 IOL 5.0 10 15 15 -- 5.0 10 15 5.0 10 15 - 3.0 - 0.64 - 1.6 - 4.2 0.64 1.6 4.2 -- -- -- -- -- -- -- -- -- -- -- -- 0.1 -- 5.0 10 20 - 2.4 - 0.51 - 1.3 - 3.4 0.51 1.3 3.4 -- -- -- -- -- - 4.2 - 0.88 - 2.25 - 8.8 0.88 2.25 8.8 0.00001 5.0 0.005 0.010 0.015 -- -- -- -- -- -- -- 0.1 7.5 5.0 10 20 - 1.7 - 0.36 - 0.9 - 2.4 0.36 0.9 2.4 -- -- -- -- -- -- -- -- -- -- -- -- 1.0 -- 150 300 600 mAdc 3.5 7.0 11 -- -- -- 3.5 7.0 11 2.75 5.50 8.25 -- -- -- 3.5 7.0 11 -- -- -- mAdc Min -- -- -- - 55_C 25_C 125_C Max Min -- -- -- Typ (4.) 0 0 0 Max Min -- -- -- Max Unit Vdc Output Voltage Vin = VDD or 0 "0" Level 0.05 0.05 0.05 -- -- -- 1.5 3.0 4.0 0.05 0.05 0.05 -- -- -- 1.5 3.0 4.0 0.05 0.05 0.05 -- -- -- 1.5 3.0 4.0 Vdc "1" Level Vin = 0 or VDD Input Voltage "0" Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) "1" Level (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Input Current Input Capacitance (Vin = 0) Quiescent Current (Per Package) Total Supply Current (5.) (6.) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) VIL -- -- -- -- -- -- 2.25 4.50 6.75 -- -- -- VOH 4.95 9.95 14.95 4.95 9.95 14.95 5.0 10 15 4.95 9.95 14.95 Vdc Vdc Sink Iin Cin IDD Adc pF Adc IT IT = (0.6 A/kHz) f + IDD IT = (1.2 A/kHz) f + IDD IT = (1.7 A/kHz) f + IDD Adc 4. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. 5. The formulas given are for the typical characteristics only at 25_C. 6. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL - 50) Vfk where: IT is in A (per package), CL in pF, V = (VDD - VSS) in volts, f in kHz is input frequency, and k = 0.002.
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MC14518B
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SWITCHING CHARACTERISTICS (7.) (CL = 50 pF, TA = 25_C)
Characteristic All Types Typ (8.) 100 50 40 Symbol tTLH, tTHL VDD 5.0 10 15 Min -- -- -- Max 200 100 80 ns 5.0 10 15 tPHL 5.0 10 15 tw(H) tw(L) fcl 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 -- -- -- 200 100 70 -- -- -- -- -- -- 440 200 140 280 120 90 -5 15 20 330 130 90 100 50 35 2.5 6.0 8.0 -- -- -- 220 100 70 125 55 40 - 45 - 15 -5 650 230 170 -- -- -- 1.5 3.0 4.0 15 5 4 -- -- -- -- -- -- -- -- -- ns -- -- -- 280 115 80 560 230 160 ns Unit ns Output Rise and Fall Time tTLH, tTHL = (1.5 ns/pF) CL + 25 ns tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns Propagation Delay Time Clock to Q/Enable to Q tPLH, tPHL = (1.7 ns/pF) CL + 215 ns tPLH, tPHL = (0.66 ns/pF) CL + 97 ns tPLH, tPHL = (0.5 ns/pF) CL + 75 ns Reset to Q tPHL = (1.7 ns/pF) CL + 265 ns tPHL = (0.66 ns/pF) CL + 117 ns tPHL = (0.66 ns/pF) CL + 95 ns Clock Pulse Width tPLH, tPHL Clock Pulse Frequency MHz Clock or Enable Rise and Fall Time tTHL, tTLH s Enable Pulse Width tWH(E) ns Reset Pulse Width tWH(R) ns Reset Removal Time trem ns 7. The formulas given are for the typical characteristics only at 25_C. 8. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. VDD 500 F ID 0.01 F CERAMIC PULSE GENERATOR C Q0 Q1 Q2 E Q3 R VSS 20 ns 50% 90% 10% VSS 20 ns CL CL CL CL VARIABLE WIDTH
Figure 1. Power Dissipation Test Circuit and Waveform
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MC14518B
VDD PULSE GENERATOR Q0 Q1 E R Q2 Q3 VSS CL CL CL CL Q tr tf 20 ns CLOCK INPUT tWH tPLH 20 ns 90% 50% 10% tWL tPHL 90% 50% 10% VDD VSS
C
Figure 2. Switching Time Test Circuit and Waveforms
1 CLOCK ENABLE RESET 1 Q0 Q1 Q2 Q3 1 Q0 Q1 Q2 Q3
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45
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78
9 10 11 12 13 14 15 16 17 18
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901
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90
MC14518B
23
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9 10 11 12 13 14 15 0
12
3
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MC14520B
Figure 3. Timing Diagram
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MC14518B
Q0 Q1 Q2 Q3
D C RESET
Q Q
D C
Q Q
D C
Q Q
D C
Q Q
R
R
R
R
ENABLE CLOCK
Figure 4. Decade Counter (MC14518B) Logic Diagram (1/2 of Device Shown)
Q0
Q1
Q2
Q3
D C RESET
Q Q
D C
Q Q
D C
Q Q
D C
Q Q
R
R
R
R
ENABLE CLOCK
Figure 5. Binary Counter (MC14520B) Logic Diagram (1/2 of Device Shown)
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MC14518B
PACKAGE DIMENSIONS
-A-
16 9
PDIP-16 P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R
B
1
8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
F S
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
SOIC-16 DW SUFFIX PLASTIC SOIC PACKAGE CASE 751G-03 ISSUE B
D
16 M 9
A
q
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 10.15 10.45 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_
H
B
1
8
16X
B TA
S
B B
S
h X 45 _
M
8X
0.25
E
0.25
M
A1
14X
e
SEATING PLANE
DIM A A1 B C D E e H h L
A
L
T
C
q
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MC14518B
PACKAGE DIMENSIONS
SOEIAJ-16 F SUFFIX PLASTIC EIAJ SOIC PACKAGE CASE 966-01 ISSUE O
LE Q1 E HE
1 8
16
9
M_ L DETAIL P
Z D e A VIEW P
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.78 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.031
c
b 0.13 (0.005)
M
A1 0.10 (0.004)
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MC14518B/D

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